TEST SOCKET FOR TESTING THE PERFORMANCE A SEMICONDUCTOR CHIP PACKAGE CAPABLE OF IMPROVING ASSEMBILITY

摘要

PURPOSE: A test socket for testing the performance a semiconductor chip package is provided to improve the life expectancy in test socket which has a frequency test process.;CONSTITUTION: A test socket includes a conductive socket pine(110), a base housing(120), and a fixing housing(130). A plurality of through-holes is arranged into a matrix type. The conductivity socket pin is inserted to the plurality of through-holes. A through-hole is formed in the fixing housing. The through-hole has an arrangement corresponding to the penetration hole. In the insertion state of the conductivity socket pine, the fixing housing is connected to the base housing.;COPYRIGHT KIPO 2012