SOCKET FOR TESTING SEMICONDUCTOR CHIP PACKAGE TESTING ANY SIZE OF SEMICONDUCTOR CHIP PACKAGE

摘要

A socket for testing a semiconductor chip package with various sizes is provided to test electrical characteristics of the semiconductor chip package by using the prior socket without replacing the socket. A socket housing(310) has a loading part(380) for a semiconductor chip package to be placed, and comprises a contact pin(390) capable of being connected to the semiconductor chip package electrically. A cover housing is connected to the socket housing. The socket housing comprises a first fixing part(320) fixing one plane of the semiconductor chip package, a second fixing part(340) fixing another plane of the semiconductor chip package, and a supporting part(360) fixing the other plane except the fixed planes.