SIGNAL DETECTION PIN FOR A TEST SOCKET IN ORDER TO PERFORM A PERFORMANCE TEST OF A SEMICONDUCTOR CHIP PACKAGE CAPABLE OF PREVENTING DAMAGE AND RUPTURE IN A FREQUENT TEST PROCESS FOR PERFORMANCE VERIFICATION

摘要

PURPOSE: A signal detection pin for a test socket in order to perform a performance test of a semiconductor chip package is provided to arrange a socket pin arranged on the test socket as a spread structure in an elastic silicon rubber material, thereby preventing damage and rupture in a frequent test process for performance verification.;CONSTITUTION: A socket pin(110) is comprised of a elastic structure including conductivity. A joint part(111) comprises a center part projected as a pillar shape. An upper terminal(113) comprises an upper end contact surface(112) based on the joint part. A lower terminal(115) comprises a lower end contact surface(114). The upper terminal and lower terminal of the socket pin are respectively able to be arranged as a structure in which the external diameter of the structure is become narrower away from the joint part. A powder type conductive material(117) has a distributed structure by spreading in a silicon rubber(116) material.;COPYRIGHT KIPO 2012