首页> 外国专利> LIGHT-EMITTING DIODE MODULE CAPABLE OF REDUCING MANUFACTURING COSTS BY REDUCING THE SIZE OF A METAL CIRCUIT SUBSTRATE

LIGHT-EMITTING DIODE MODULE CAPABLE OF REDUCING MANUFACTURING COSTS BY REDUCING THE SIZE OF A METAL CIRCUIT SUBSTRATE

机译:通过减小金属电路基板的尺寸来减小制造成本的发光二极管模块

摘要

PURPOSE: A light-emitting diode module is provided to prevent a LED from turning off or flickering due to power failure by being stably connected to the line supplying a current to the LED.;CONSTITUTION: In a light-emitting diode module, a substrate(140) is mounted inside a housing(120). A penetration hole is formed in the lower part of a housing and a wire supplying a current is formed in the penetration hole. The substrate comprises A metal circuit substrate(142) and a circuit board(144). A wiring layer is formed in the metal circuit substrate and supplies current to the LED. An insulating tube through hole is formed in the circuit substrate and is electrically connected to the wire and wiring layer.;COPYRIGHT KIPO 2012
机译:目的:提供一种发光二极管模块,通过将其稳定地连接到向LED供电的线路来防止因电源故障而导致LED熄灭或闪烁。组成:在发光二极管模块中,基板(140)安装在壳体(120)内。在壳体的下部形成有贯通孔,在该贯通孔中形成有供给电流的电线。基板包括金属电路基板(142)和电路板(144)。布线层形成在金属电路基板中并且向LED供应电流。绝缘管通孔形成在电路基板中,并与导线和布线层电连接。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20110126456A

    专利类型

  • 公开/公告日2011-11-23

    原文格式PDF

  • 申请/专利权人 SAMSUNG LED CO. LTD.;

    申请/专利号KR20100046138

  • 发明设计人 JUNG MYUNG SIK;

    申请日2010-05-17

  • 分类号H01L33/62;H01L33/64;

  • 国家 KR

  • 入库时间 2022-08-21 17:11:39

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