PLATE OF SHIELD CAN FOR SMD PROCESS, A MANUFACTURING METHOD FOR THE PLATE AND SHIELD CAN USING THE PLATE, CAPABLE OF SHIELDING THE ELECTROMAGNETIC WAVE OF AN ELECTRONIC COMPONENT

摘要

PURPOSE: A plate of shield can for SMD process, a manufacturing method for the plate and shield can using the plate are provided to implement a shield can having heat resistance.;CONSTITUTION: A conductive layer(12) is formed with a clad metal which is comprised of at last one of copper, zinc, nickel, silver, iron, and chrome or alloy. The conductive layer performs electromagnetic wave shield function and maintain a physical architecture in forming shield can. An insulating layer(14) is formed with one of PET, and PEN such as a crystalline polymer phosphorus The insulating layer is laminated in one side of the metal conducting layer. A silane system coupling layer is formed between the insulating layer and the metal conducting layer. The conductive layer is exposed to outside and has the insulating layer covering an electronic component.;COPYRIGHT KIPO 2012