Electromagnetic interference shielding effectiveness of sol-gel coating on Cu-plated fabrics

摘要

In this work, we developed the electromagnetic shielding effective (EMI SE) polyester woven fabrics by simple electroless plating with copper. Subsequently, it was coated with various precursors to investigate their influence on the EMI SE values. In addition, we studied the effect of copper sulfate concentration and the number of dips required to improve the EMI SE values. The results of the experiment confirm that the Cu particle deposition on the fabric has a strong influence on the EMI SE values. EMI shielding is directly proportional to the concentration of copper particles as well as the sol-gel coating process. However, the EMI SE value of sol-gel coated Cu-plated fabric depends on the type of precursor. Among the precursors, Triethoxyphenylsilane provides two times higher EMI SE values than the Cu-plated fabrics which is a novel effect. The morphology of deposited copper particles was studied by employing SEM analysis in order to find the durability of copper particles on the polyester fabric surface. It was observed that the copper particles that are coated on the fabric pores have no significant decrease in air permeability due to partial coverage.