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METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE CAPABLE OF PREVENTING ELECTRICAL CHARACTERISTIC DETERIORATION OF A SEMICONDUCTOR CHIP
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE CAPABLE OF PREVENTING ELECTRICAL CHARACTERISTIC DETERIORATION OF A SEMICONDUCTOR CHIP
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机译:制造可防止半导体芯片电气特性恶化的半导体封装的方法
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摘要
PURPOSE: A method for manufacturing a semiconductor package is provided to steadily fill a space between a semiconductor chip and a substrate without the generation of void by filling the space with ball type filler which is liquefied.;CONSTITUTION: A plurality of bonding pads(110) and a dummy pad(120) are formed on one side of a semiconductor chip(100). A connection member(130) is attached on the bonding pad of the semiconductor chip. The connection member comprises a bump. A plurality of ball type fillers(140) is attached on the dummy pad of the semiconductor chip. The semiconductor chip is flip-chip-bonded on the upper side of a substrate by the connection member. A space between the flip-chip-bonded semiconductor chip and the substrate is filled with the ball type filler.;COPYRIGHT KIPO 2012
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