BALL LAND, PRINTED CIRCUIT BOARD AND WAFER LEVEL PACKAGE HAVING THE BALL LNAD

摘要

PURPOSE: A wafer level package, a printed circuit board which includes a ball land, and the ball land are provided to easily eliminate a solder ball by breaking a fragile member of the ball land during a reworking process, thereby recycling a semiconductor package. CONSTITUTION: A substrate(10) comprises an insulating film pattern(12) which includes an opening part(12A) and a substrate body(11). A ball land(20) is formed on the substrate. The ball land includes a first conductive film pattern(21), a fragile member(22), and a second conductive film pattern(23). The first conductive film pattern is formed on the substrate body exposed by the opening part. The fragile member is formed in order to cover the surface of the insulating film pattern exposed by the opening part. A solder ball(30) is installed on the second conductive film pattern.