ELECTRONIC DEVICE CAPABLE OF INCREASING BONDING RELIABILITY BY BONDING FIRST AND SECOND SUBSTRATES WITH FIRST AND SECOND BONDING PARTS AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An electronic device and a manufacturing method thereof are provided to bond first and second substrates with air bubbles in an optical shutter, thereby facilitating processes.;CONSTITUTION: A second substrate(200) is separated from a first substrate(100). A first bonding part(112) bonds the first and second substrates between the first substrate and the second substrate. The first bonding part includes an opening(107). A second bonding part(114) bonds the first and second substrates. The second bonding part surrounds the first bonding part. The second bonding part includes a closed loop.;COPYRIGHT KIPO 2012