首页> 外国专利> ELECTRONIC DEVICE CAPABLE OF INCREASING BONDING RELIABILITY BY BONDING FIRST AND SECOND SUBSTRATES WITH FIRST AND SECOND BONDING PARTS AND A MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE CAPABLE OF INCREASING BONDING RELIABILITY BY BONDING FIRST AND SECOND SUBSTRATES WITH FIRST AND SECOND BONDING PARTS AND A MANUFACTURING METHOD THEREOF

机译:具有通过将第一和第二接合部分接合的第一和第二基材来提高接合可靠性的电子设备及其制造方法

摘要

PURPOSE: An electronic device and a manufacturing method thereof are provided to bond first and second substrates with air bubbles in an optical shutter, thereby facilitating processes.;CONSTITUTION: A second substrate(200) is separated from a first substrate(100). A first bonding part(112) bonds the first and second substrates between the first substrate and the second substrate. The first bonding part includes an opening(107). A second bonding part(114) bonds the first and second substrates. The second bonding part surrounds the first bonding part. The second bonding part includes a closed loop.;COPYRIGHT KIPO 2012
机译:用途:提供一种电子装置及其制造方法,以使第一基板和第二基板与光学快门中的气泡结合,从而简化工艺。组成:第二基板(200)与第一基板(100)分离。第一结合部分(112)在第一基底和第二基底之间结合第一基底和第二基底。第一结合部分包括开口(107)。第二结合部分(114)结合第一和​​第二基板。第二结合部分围绕第一结合部分。第二个绑定部分包括一个闭环。; COPYRIGHT KIPO 2012

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