HIGHLY HEAT-RESISTANT RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, CAPABLE OF BEING PROCESSED UNDER HIGH TEMPERATURE LIKE LEAD-FREE REFLOW PROCESS, AND A PRODUCT MANUFACTURED BY USING THE SAME

摘要

PURPOSE: A highly heat-resistant composition is provided to have excellent thermal resistance by having glass transition temperature of 220 °C or higher, thereby maintaining substrates without damage even under high temperature process condition like lead-free reflow process.;CONSTITUTION: A highly heat-resistant composition comprises a cycloaliphatic resin in chemical formula 1 as a main component. In chemical formula 1, R is a C1-20 alkyl group, n is an integer from 10-30. The highly heat-resistant composition comprises a cyclo aliphatic resin in chemical formula 1, and 10-100.0 parts by weight of a cyanate ester resin in chemical formula 2.;COPYRIGHT KIPO 2012