Process for producing a phosphorus -containing epoxy resin, a curing resin composition , a cured product thereof , for the printed circuit board resin composition , a printed circuit board , flexible printed circuit board resin composition , a semiconductor encapsulating material for a resin composition , and build up board for inter-layer insulation material for resin composition .

摘要

PROBLEM TO BE SOLVED: To provide a method for industrially producing a phosphorus atom-containing epoxy resin excellent in solvent solubility and heat resistance of the cured product in good productivity; a curable resin composition excellent in solvent solubility and heat resistance of the cured product and its cured product; and a resin composition for a printed wiring board, a printed wiring board, a resin composition for a flexible wiring board, a resin composition for a semiconductor sealing material, and a resin composition for an interlayer insulation material for a buildup substrate, each obtained by using the phosphorus atom-containing epoxy resin.;SOLUTION: This method for producing the phosphorus atom-containing epoxy resin comprises: reacting an aromatic aldehyde (a1) having an alkoxy group as a substituent group on the aromatic nucleus and an organophosphorus compound (a2) having a P-H group or P-CH group in the molecular structure; then reacting the obtained reaction product with phenol (a3) to obtain a phosphorus atom-containing phenol compound; and then reacting the obtained phosphorus atom-containing phenol compound with epihalohydrin.;COPYRIGHT: (C)2012,JPO&INPIT