Process for producing a curable resin composition, cured product thereof, phosphorus-containing phenols, the printed circuit board resin composition for a printed wiring board, flexible printed circuit board resin composition for semiconductor encapsulation material for a resin composition, and build up board for interlayer insulation material resin composition for

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in flame retardancy and heat resistance of a cured article, and achieving extremely low linear expansion coefficient; a cured article thereof; a process for production of phosphorus-containing phenols utilized therefor; a resin composition for a printed wiring board using the curable resin composition; a printed wiring board; a resin composition for a flexible wiring board; a resin composition for encapsulating material for a semiconductor; and a resin composition for an interlayer insulating material for a build-up substrate.;SOLUTION: An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is reacted with an organic phosphorus compound (a2) having a P-H or P-OH group in its molecular structure, and the resulting reaction product is reacted with a phenol resin (a3) having a bis(hydroxyphenylene)sulfone structure to produce phosphorus-containing phenols (A). The curable resin composition includes the phosphorus-containing phenols (A) and an epoxy resin (B) as essential components.;COPYRIGHT: (C)2012,JPO&INPIT