TIN/TIN ALLOY NANO PARTICLE WITH LOW MELTING TEMPERATURE AND A MANUFACTURING METHOD THEREOF, CAPABLE OF MINIMIZING THE DEFORMATION OF A PRINTED CIRCUIT BOARD BY LOWERING THE TEMPERATURE OF A REFLOW PROCESS

摘要

PURPOSE: A tin/tin alloy nano particle with low melting temperature and a manufacturing method thereof are provided to save energy of 22% because heating temperature is lowered to 240 to 160°C in a reflow process.;CONSTITUTION: A tin/tin alloy nano particle has a particle size of 1 to 2mm. A surface melting temperature measured by a DSC(Differential Scanning Calorimetry) is within a range of 80 to 130°C. A tin/tin alloy comprises one selected from a group being composed of tin, silver, copper, lead, and nickel and a combination thereof.;COPYRIGHT KIPO 2012