Method of heating printed circuit boards having coating comprises inductive preheating to temperature below/equal to melting point of coating, maintaining temperature to allow diffusion and heating to final temperature by inductive heating

摘要

The method comprises inductive preheating of printed circuit boards to a temperature that is below or equal to the melting point of a coating of the boards, maintaining or optionally increasing the temperature of the boards by indirect inductive or conventional heating to allow diffusion within the boards, heating the boards to a final temperature by inductive heating, handling, press hardening and/or mold hardening the boards, and conveying the boards within a heating device using a conveyor system (5) having ceramic belts. An independent claim is included for a device for heating printed circuit boards.