首页> 外国专利> METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD FOR AN OPTICAL WAVE GUIDE BY FORMING A CURVED PART WITH A PATTERN TRANSFORMED IN A CORE LAYER AND ATTACHING A REFLECTIVE MEMBER TO THE CURVED PART

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD FOR AN OPTICAL WAVE GUIDE BY FORMING A CURVED PART WITH A PATTERN TRANSFORMED IN A CORE LAYER AND ATTACHING A REFLECTIVE MEMBER TO THE CURVED PART

机译:通过形成具有在核心层中变换的图案的弯曲部分并将反射性构件附着到弯曲部分来制造用于光学波导的印刷电路板的方法

摘要

PURPOSE: A method for manufacturing a printed circuit board for an optical wave guide is provided to improve the reflectivity of a printed circuit board and thereby reduce the optical loss.;CONSTITUTION: A lower clad layer is formed on a base(S11). A core material is coated on the lower clad layer(S12). The core material is exposed using a photomask having a pattern(S13). The core material is developed and a curved part with the pattern transformed is processed in a core layer(S14). An upper clad layer is coated on the lower clad layer(S15). The upper clad layer is exposed and developed so that a portion of the curved part is exposed outside(S16). A reflective member is attached to the exposed portion of the curved part(S17).;COPYRIGHT KIPO 2012
机译:目的:提供一种用于制造光波导的印刷电路板的方法,以提高印刷电路板的反射率,从而减少光学损耗。;组成:在基底上形成下覆层(S11)。将芯材涂覆在下覆层上(S12)。使用具有图案的光掩模对芯材进行曝光(S13)。对芯材料进行显影,并且在芯层中处理具有变换后的图案的弯曲部分(S14)。在下包层上涂覆上包层(S15)。上包层暴露并显影,使得弯曲部分的一部分暴露在外部(S16)。反射构件附接到弯曲部分的暴露部分(S17)。; COPYRIGHT KIPO 2012

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