EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR DEVICE USING THE SAME CAPABLE OF ENHANCING ADHESIVE PROPERTY AND NOT GENERATING INNER PORES WITHIN THE SEMICONDUCTOR DEVICE

摘要

PURPOSE: An epoxy resin composition for sealing semiconductor devices and a semiconductor device using thereof are provided to enhance adhesive force with a PSR(photo image-able solder resist mask) layer of PCB and to maintain mobility, moldability, and fire retardance.;CONSTITUTION: An epoxy resin composition for sealing semiconductor devices comprises an epoxy resin, a hardener, inorganic filler, and a siloxane compound. The siloxane compound comprises octamethylcyclotetrasiloxane. 0.01-2 weight% of the octamethyltetrasiloxane is used based on total weight of the epoxy resin composition. The siloxane compound additionally includes amine modified siloxane which is represented as chemical formula 1. In the chemical formula 1, R1 and R2 respectively and independently indicate C1-4 alkyl group or C6-12 aryl group, and n indicates integer of 1-4.;COPYRIGHT KIPO 2012