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FABRICATION METHOD OF SILICON QUANTUM DOT LAYER AND DEVICES FABRICATED USING THE SAME

机译:硅量子点层的制造方法和使用该器件制造的设备

摘要

PURPOSE: A method for fabricating a silicon quantum dot layer and devices manufactured thereby are provided to reduce manufacturing costs by forming multilayer consisting of a silicon quantum dot layer and a polycrystalline silicon layer. CONSTITUTION: A first cover layer(CAP1) is formed on a substrate(SUB). A silicon containing precursor layer(SCP) is formed on the first cover layer. A second cover layer(CAP2) is formed on the silicon containing precursor layer. The silicon containing precursor layer is changed to a first polycrystalline silicon layer, a silicon quantum dot layer, and a second polycrystalline silicon layer successively laminated by irradiating the first cover layer with continuous wave laser or a flash lamp, the silicon containing precursor layer, and the second cover layer.
机译:目的:提供一种用于制造硅量子点层的方法和由此制造的器件,以通过形成由硅量子点层和多晶硅层组成的多层来降低制造成本。组成:第一覆盖层(CAP1)形成在基板(SUB)上。在第一覆盖层上形成含硅的前驱体层(SCP)。在含硅的前体层上形成第二覆盖层(CAP2)。通过用连续波激光或闪光灯照射第一覆盖层,将含硅前驱体层改变为依次层叠的第一多晶硅层,硅量子点层和第二多晶硅层,所述含硅前驱体层和第二覆盖层。

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