SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME CAPABLE OF PREVENTING A BENDING PHENOMENON

摘要

PURPOSE: A semiconductor package having a lead frame is provided to steadily load a semiconductor chip by doubly supporting the semiconductor chip through a first frame and a second frame.;CONSTITUTION: A semiconductor chip(140) is mounted in a lead frame. The lead frame is electrically connected to the semiconductor chip by a plurality of bonding wires. The lead frame comprises a first lead frame and a second lead frame. The first lead frame and the second lead frame support the semiconductor chip. A mold layer(160) molds the semiconductor chip and the lead frame. The first lead frame has outer leads projected from the mold layer. The first lead frame is combined with the second lead frame by an insulating adhesive layer. The second lead frame has a die pad of plate type.;COPYRIGHT KIPO 2012