HEAD ASSEMBLY OF A CHIP MOUNTER IMPROVING WORK EFFICIENCY AND A COMPONENT ADSORBING METHOD USING THE SAME

摘要

PURPOSE: A head assembly of a chip mounter and a component adsorbing method using the same are provided to improve work efficiency by increasing the density of a spindle nozzle included in the head assembly.;CONSTITUTION: A head group(100) includes one or more head modules(101-105) fixed to a head frame(200). The head module includes a first spindle nozzle(151) and a second spindle nozzle(152). The head module includes a first spindle(141) supporting the first spindle nozzle and a second spindle(142) supporting the second spindle nozzle. The head module includes a first drive unit(131) driving the first spindle and a second drive unit(132) driving the second spindle.;COPYRIGHT KIPO 2013