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HEAD ASSEMBLY OF CHIP MOUNTER AND METHOD FOR ADSORBING CHIP AND MOUNTING CHIP OF HEAD ASSEMBLY USING THE SAME
HEAD ASSEMBLY OF CHIP MOUNTER AND METHOD FOR ADSORBING CHIP AND MOUNTING CHIP OF HEAD ASSEMBLY USING THE SAME
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机译:芯片安装器的头部组件以及使用该组件的头部组件的吸附和安装芯片的方法
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摘要
PURPOSE: A head assembly of a chip mounter and a method for absorbing and mounting the head assembly using the same are provided to absorb and mount components regardless of an interval between feeders by controlling the interval between nozzle spindles. CONSTITUTION: A rotation bracket(120) is rotatably installed in a head frame(110). A first driver(130) rotates the rotation bracket. First and second spindle brackets(140) are movably installed in both ends of the rotation bracket. The first and second spindle brackets move by a linear motor. First and second nozzle spindles(150) are installed in the first and second spindle brackets. A second driver(160) rotates the first and second nozzle spindles.
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