CMP Slurry composition for copper damascene process

摘要

present invention is colloidal silica containing a chemical mechanical polishing slurry to be said about colloidal silica oxidizing the silicon (Si) powder in an aqueous solution under a basic catalyst is characterized in that the manufacture by direct oxidation to form the silica. ; colloidal silica contained in the slurry for chemical mechanical polishing according to the present invention is prepared by direct oxidation method , and the advantages , as well as a small impurity content less expensive production cost , for use in chemical mechanical polishing particles have the advantage of being a more suitable surface shape and dispersion stability and is suitable for use in the chemical mechanical polishing of a substrate comprising copper .