A CARRIER FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME AND A METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A carrier for manufacturing a printed circuit board and a manufacturing method thereof and a method for manufacturing a printed circuit board using the same are provided to reduce process cost and process time, by simplifying the structure of the carrier without using vacuum method or hetero-layer insertion method between the carrier and the printed circuit board. CONSTITUTION: Two first metal layers(101) are in contact with each other. A first protection layer(102) is formed on the first metal layer. A bonding means(103) is formed to surround the side of the first protection layer and the first metal layer. A second metal layer(105) is formed on the first protection layer and the bonding means.