首页> 外国专利> MANUFACTURING METHOD OF DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD AND DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD THEREOF

MANUFACTURING METHOD OF DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD AND DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD THEREOF

机译:双面多层柔性印刷电路板的制造方法及用该方法制造的双面多层柔性印刷电路板的制造方法

摘要

PURPOSE: A double-sided multilayered flexible printed circuit board and a manufacturing method thereof are provided to reduce the number of processes by using a roll-to-roll mode. CONSTITUTION: A dry film is laminated on one side of a flexible copper foil laminated plate for inner layer(S200). The copper foil laminated plate is exposed by using a roll-to-roll exposure(S300). A necessary circuit pattern is formed by developing and etching the exposed double-sided copper foil laminated plate(S400). A coverlay is tack welded on one side on which the circuit is formed(S500). An inner layer and an outer layer are simultaneously hot pressed by positioning a flexible copper foil laminated plate for outer layer on the outermost layer.
机译:目的:提供一种双面多层柔性印刷电路板及其制造方法,以通过使用卷对卷模式来减少工序数量。组成:干膜层压在用于内层的柔性铜箔层压板的一侧(S200)。通过使用卷对卷曝光来曝光铜箔层压板(S300)。通过显影和蚀刻暴露的双面铜箔层压板来形成必要的电路图案(S400)。在其上形成电路的一侧上点焊覆盖层(S500)。通过将用于外层的柔性铜箔层压板放置在最外层上,同时热压内层和外层。

著录项

  • 公开/公告号KR101180355B1

    专利类型

  • 公开/公告日2012-09-07

    原文格式PDF

  • 申请/专利权人 BH CO. LTD.;

    申请/专利号KR20120017213

  • 发明设计人 LEE KYUNG HWAN;KANG DONG WEON;

    申请日2012-02-21

  • 分类号H05K3/46;H05K3/28;

  • 国家 KR

  • 入库时间 2022-08-21 17:07:33

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