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MANUFACTURING METHOD OF DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD AND DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD THEREOF
MANUFACTURING METHOD OF DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD AND DUAL SIDE MULTI LAYER TYPED FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD THEREOF
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机译:双面多层柔性印刷电路板的制造方法及用该方法制造的双面多层柔性印刷电路板的制造方法
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摘要
PURPOSE: A double-sided multilayered flexible printed circuit board and a manufacturing method thereof are provided to reduce the number of processes by using a roll-to-roll mode. CONSTITUTION: A dry film is laminated on one side of a flexible copper foil laminated plate for inner layer(S200). The copper foil laminated plate is exposed by using a roll-to-roll exposure(S300). A necessary circuit pattern is formed by developing and etching the exposed double-sided copper foil laminated plate(S400). A coverlay is tack welded on one side on which the circuit is formed(S500). An inner layer and an outer layer are simultaneously hot pressed by positioning a flexible copper foil laminated plate for outer layer on the outermost layer.
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