METHOD TO MANUFACTURE Cu-Ge OHMIC CONTACT TO GaAs

摘要

FIELD: electricity.;SUBSTANCE: in the method to manufacture Cu-Ge ohmic contact on the surface of the plate n-GaAs or epitaxial heterostructure GaAs with n-layer a resistive mask is developed, fims of Ge and Cu are deposited, the first thermal treatment is carried out in the atmosphere of atomic hydrogen at the temperature from 20 to 150°C and density of hydrogen atoms flow to the surface of the plate equal to 10¹³-10¹⁶ at.cm^-2 s^-1. Plates are withdrawn from a vacuum chamber of a spraying plant, the resistive mask is removed before or after the first thermal treatment, and the second thermal treatment is carried out.;EFFECT: reduced value of the given contact resistance.;7 cl, 1 dwg