Partial electroplating of substrate, comprises applying electrically non-conductive coating material comprising ink jet module on regions of electrically conductive substrate, which is not to be coated

摘要

Partial electroplating of a substrate (9), comprises applying an electrically non-conductive coating material comprising an ink jet module (1) on regions of electrically conductive substrate, which is not to be coated, or applying an electrically conductive coating material comprising an ink jet module, on regions of electrically non-conductive substrate to be coated. An independent claim is also included for a device for partial electroplating of the substrate, comprising at least one ink jet module, which is formed for applying a non-electrically conductive coating material on regions of the conductive substrate, which is not to be coated and/or an electrically conductive coating material on the regions of the non-conductive substrate to be coated, and a conveyor for moving the substrate along a conveyor line.