首页> 外国专利> Producing porous metal-coated substrate, preferably electrically conductive or gas-conducting substrate, comprises joining alloy comprising coating of metal and base metal with material of substrate, and dissolving support metal of alloy

Producing porous metal-coated substrate, preferably electrically conductive or gas-conducting substrate, comprises joining alloy comprising coating of metal and base metal with material of substrate, and dissolving support metal of alloy

机译:制备多孔金属涂覆的基材,优选为导电或导气的基材,包括将包含金属和贱金属涂层的合金与基材材料接合,并溶解合金的支撑金属。

摘要

Producing a porous metal-coated substrate, preferably an electrically conductive and/or gas-conducting substrate, comprises joining an alloy comprising a coating of metal and a base metal with a material of a substrate, and dissolving the support metal of the alloy associated with the material of the substrate. An independent claim is also included for a porous substrate, preferably ceramic substrate, which is electrically conductive and/or gas-conducting.
机译:制备多孔金属涂覆的基材,优选为导电和/或导气的基材,包括将包含金属和贱金属的涂层的合金与基材的材料接合,以及溶解与所述金属相关的合金的支撑金属。基材的材料。对于多孔基底,优选地是陶瓷基底,还包括独立的权利要求,所述多孔基底是导电的和/或气体导电的。

著录项

  • 公开/公告号DE102012022846A1

    专利类型

  • 公开/公告日2014-05-28

    原文格式PDF

  • 申请/专利权人 UNIVERSITÄT BAYREUTH;

    申请/专利号DE20121022846

  • 申请日2012-11-23

  • 分类号B22F3/10;C22C23;C22C14;C22C16;C22C5/04;C22C19;C22C9;C22C32;

  • 国家 DE

  • 入库时间 2022-08-21 15:37:54

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