Method for producing molding compound surrounded by circuit substrate, involves performing connection by bonding wire prior to encapsulation of substrate facing end of conductor track foil having tying up region on circuit substrate

摘要

The method involves connecting circuit substrate (10) indirectly to flexible printed circuit film (15), to which existing composite component (25) of conductor track foil and substrate is molded from the molding compound (1). The electrical connection between the substrate and conductor track foil within the molding compound is performed by additional electrical connector element in the form of bonding wire (14). The connection by the bonding wire is performed prior to encapsulation of substrate facing the end of conductor track foil having tying up region on substrate.