Method for manufacturing heat exhausting device in electronic device, involves stacking cooling bodies such that heat pipe is arranged between cooling bodies, and soldering cooling bodies with solder paste

摘要

The method involves providing multiple slat cooling bodies (12, 13) and a heat pipe (11) e.g. aluminum pipe, where the bodies comprise a bonding surface (121) and the heat pipe comprises a contact surface (111). An anodizing surface treatment is performed at the bodies. The bonding surface is roughened, and the contact surface of the pipe is spray coated with a metallic substance i.e. copper. The bodies are stacked such that the pipe is arranged between the bodies and the bonding surface is contacted with the contact surface of the pipe. The bodies are soldered with solder paste. An independent claim is also included for a heat exhausting device.