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Polymer compound substrate having glass-like surface, and chip made of said polymer compound substrate

机译:具有玻璃状表面的高分子化合物基板以及由该高分子化合物基板制成的芯片

摘要

The present invention relates to a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface and to a chip made of at least one such polymeric substrate. The present invention also relates to a method of providing a polymeric substrate with an etched-glass-like surface. Moreover, the present invention relates to a kit for manufacturing a chip using such polymeric substrate. Moreover, the present invention relates to the use of a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface for manufacturing a chip.
机译:本发明涉及一种具有玻璃状表面,特别是蚀刻玻璃状表面的聚合物基底,并且涉及一种由至少一种这样的聚合物基底制成的芯片。本发明还涉及一种提供具有蚀刻玻璃状表面的聚合物基底的方法。而且,本发明涉及一种用于使用这种聚合物基板制造芯片的套件。此外,本发明涉及具有玻璃状表面,特别是蚀刻玻璃状表面的聚合物基底在制造芯片中的用途。

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