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TRANSPARENT THERMOCONDUCTIVE COMPOSITION

机译:透明的导热成分

摘要

PROBLEM TO BE SOLVED: To provide a transparent thermoconductive composition excellent in transparency and thermal conductivity, and capable of dealing with various applications.;SOLUTION: This transparent thermoconductive composition includes a resin and a filler, where the filler comprises a thermoconductive filler having an average particle diameter of 1-100 μm and a coefficient of thermal conductivity of ≥2 W/m×K and a high refractive index filler having an average particle diameter of 1-100 nm and ≥1.8 refractive index. With such a transparent thermoconductive composition, various resins and fillers can be used according to purposes and applications, and excellent transparency and thermoconductivity can be secured. Thereby such a transparent thermoconductive composition can be used in various heat dissipation applications requiring transparency and thermoconductivity.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种透明性和导热性优良的透明导热组合物,并且能够应对各种应用。解决方案:该透明导热组合物包含树脂和填料,其中所述填料包括具有平均含量的导热填料。颗粒直径为1-100μm,导热系数为≥2W / m×K,平均折射率为1-100 nm,折射率≥1.8的高折射率填料。通过使用这样的透明导热性组合物,可以根据目的和用途使用各种树脂和填充剂,可以确保优异的透明性和导热性。因此,这种透明的导热组合物可用于要求透明性和导热性的各种散热应用中。;版权所有:(C)2013,日本特许厅&INPIT

著录项

  • 公开/公告号JP2012229317A

    专利类型

  • 公开/公告日2012-11-22

    原文格式PDF

  • 申请/专利权人 NITTO DENKO CORP;

    申请/专利号JP20110097896

  • 发明设计人 HIRANO KEISUKE;

    申请日2011-04-26

  • 分类号C08L101/00;C08K3/22;C08K3/24;C09K5/08;C09K5/00;H01L23/29;H01L23/31;H01L33/56;H01L33/64;

  • 国家 JP

  • 入库时间 2022-08-21 17:00:33

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