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SEMICONDUCTOR DEVICE WITH TEG PAD AND ITS TEG PAD ARRAY METHOD

机译:带有TEG PAD的半导体装置及其TEG PAD阵列方法

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device, including a plurality of TEG PADs, such that a probe is not apt to step out of a PAD even when the plurality of TEG PADs are measured simultaneously using a cantilever type probe card, and an array method for TEG PAD such that the probe is not apt to step out of a PAD for the a semiconductor device.;SOLUTION: There are provided the semiconductor device which includes the plurality of TEG PADs to be measured by bringing a plurality of probes into contact simultaneously, and is characterized in that the center position of each TEG PAD is arranged within a rectangular area defined as a diagonal between a drop position where a probe is dropped on each TEG PAD and a contact position where the probe finally stops to come into contact; and its TEG PAD array method.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种包括多个TEG PAD的半导体器件,使得即使使用悬臂式探针卡同时测量多个TEG PAD时,探针也不容易脱离PAD。用于TEG PAD的阵列方法,以使探针不适合从用于半导体器件的PAD中脱出;解决方案:提供了一种半导体器件,该半导体器件包括通过将多个探针插入而进行测量的多个TEG PAD其特征在于,每个TEG PAD的中心位置布置在矩形区域内,该矩形区域被定义为在将探针放置在每个TEG PAD上的下降位置与探针最终停止进入的接触位置之间的对角线之间联系; ;及其TEG PAD阵列方法

著录项

  • 公开/公告号JP2012231054A

    专利类型

  • 公开/公告日2012-11-22

    原文格式PDF

  • 申请/专利权人 RENESAS ELECTRONICS CORP;

    申请/专利号JP20110099192

  • 发明设计人 SHINTAKU HIDEOMI;

    申请日2011-04-27

  • 分类号H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 17:00:20

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