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SEMICONDUCTOR DEVICE WITH TEG PAD AND ITS TEG PAD ARRAY METHOD
SEMICONDUCTOR DEVICE WITH TEG PAD AND ITS TEG PAD ARRAY METHOD
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机译:带有TEG PAD的半导体装置及其TEG PAD阵列方法
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摘要
PROBLEM TO BE SOLVED: To provide a semiconductor device, including a plurality of TEG PADs, such that a probe is not apt to step out of a PAD even when the plurality of TEG PADs are measured simultaneously using a cantilever type probe card, and an array method for TEG PAD such that the probe is not apt to step out of a PAD for the a semiconductor device.;SOLUTION: There are provided the semiconductor device which includes the plurality of TEG PADs to be measured by bringing a plurality of probes into contact simultaneously, and is characterized in that the center position of each TEG PAD is arranged within a rectangular area defined as a diagonal between a drop position where a probe is dropped on each TEG PAD and a contact position where the probe finally stops to come into contact; and its TEG PAD array method.;COPYRIGHT: (C)2013,JPO&INPIT
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