HEAT SINK, METHOD OF MANUFACTURING HEAT SINK, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a heat sink which enables a metal/diamond complex to present heat conductivity close to its original heat conductivity.;SOLUTION: A heat sink 11 includes a mounting plane 11a for mounting a device thereon and comprises a metal region 15 which is provided on a principal surface 13a of a base 13. The principal surface 13a includes projections 23a-23c formed from diamond particles 17 and recesses 25a-25c which are positioned between the projections 23a-23c and differently from a solder material, the recesses 25a-25d are filled by the metal region 15 comprised of a metal of which the fusion point is higher than that of the solder material, and the mounting plane 11a is reconfigured into roughness smaller than roughness comprised of the projections 23a-23c and the recesses 25a-25d. Therefore, an effective contact area between a mounting plane of the device and the surface 11a of the heat sink 11 can be made closer to an area of the mounting plane of the device.;COPYRIGHT: (C)2013,JPO&INPIT