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Semiconductor inspection method and apparatus that takes into account the influence of the electron beam

机译:考虑电子束影响的半导体检查方法和装置

摘要

Disclosed is a device capable of probing with minimal effect from electron beams. Rough probing is made possible using a lower magnification than the magnification usually viewed. When target contact of semiconductor is detected, measurement position is set in the center of picture usually to move probe without moving stage. With the miniaturization, contact can be confirmed only at high magnification, although probe can be confirmed at low magnification on the contrary but it is necessary to display it in real time. Static image obtained at high magnification once is combined with image obtained at low magnification in real time from target contact required for probing and characteristic of probe to be displayed, so that probing at low magnification can be realized to reduce the effects of electron beams and obtain accurate electrical characteristics.
机译:公开了一种能够以最小的电子束影响进行探测的装置。使用比通常看到的放大倍数小的放大倍率可以进行粗略的探测。当检测到半导体的目标接触时,通常将测量位置设置在图片的中心以移动探针而不移动平台。通过小型化,仅可以在高倍率下确认接触,尽管相反可以在低倍率下确认探针,但是必须实时显示。一次将高倍率获得的静态图像与低倍率获得的图像进行实时组合,这些图像是从探测所需的目标接触和要显示的探头特性实时获得的,因此可以实现低倍率的探测,以减少电子束的影响并获得准确的电气特性。

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