COMPONENT TRANSFER DEVICE AND ADSORPTION POSITION ADJUSTMENT METHOD IN COMPONENT TRANSFER DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a component transfer device capable of raising position accuracy of wafer component adsorption by an attachment head, and an adsorption position adjustment method in the component transfer device.SOLUTION: A component transfer device 100 includes: a wafer holding table 5 capable of holding a bare chip 11c; a push up part 6 which pushes the bare chip 11c held in the wafer holding table 5 up from a lower part; wafer heads 7a-7d which adsorb the bare chip 11c or a chip 11c for adjustment; a substrate recognition camera 41b (42b); and a control part 12. Then, the control part 12 is constituted so as to pick up the chip 11c for adjustment in a state of being adsorbed by the wafer heads 7a-7d in adjustment of adsorption positions with the substrate recognition camera 41b (42b), and to adjust adsorption positions of the bare chip 11a by the wafer heads 7a-7d on the basis of imaging results of the chip 11c for adjustment.