Composite resin layer coated copper foil, a manufacturing method of the composite resin layer coated copper foil, a manufacturing method of a flexible double-sided copper-clad laminate and a three-dimensional molded printed circuit board

摘要

PROBLEM TO BE SOLVED: To provide a technology of manufacturing a multilayer flexible printed wiring board excellent in stability in form of the multilayer flexible printed wiring board even after mounted and excellent in flexibility.;SOLUTION: In order to achieve the object, in a copper foil with a composite resin layer on its one surface, the copper foil with the composite resin layer used for manufacturing a solid molding printed wiring board is invented, wherein the resin layer is formed by laminating in order a cured and flexible polymer layer in contact with the copper foil layer and a semi-cured thermosetting resin layer of a thermosetting resin composition. In addition, a method of manufacturing the flexible double-sided copper clad laminate and the solid molding printed wiring board using the copper foil with the composite resin layer is adopted.;COPYRIGHT: (C)2011,JPO&INPIT