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Joint structure of multilayer printed circuit board, multilayer printed circuit board and coaxial connector

机译:多层印刷电路板,多层印刷电路板和同轴连接器的接合结构

摘要

PPROBLEM TO BE SOLVED: To provide a multiplayer printed circuit board and a connection structure which can reduce the reflection of a signal on an interface between a coaxial connector and the multiplayer printed circuit board and can be put into practical use at a low cost by securing the continuity of an electromagnetic field distribution at the interface at a higher level. PSOLUTION: A multiplayer printed circuit board 1 has a microstrip line 2 as a signal layer, and a plurality of grounding layers 3a, 4a, 5a, 6a, 7a provided on the lower part of the microstrip line 2 to be electrically connected mutually. Notches K3, K4, K5, K6 are provided in at least some grounding layers 3a, 4a, 5a, 6a of the plurality of grounding layers 3a, 4a, 5a, 6a, 7a, and the sizes of the notches K3, K4, K5, K6 are made different for each of the grounding layers 3a, 4a, 5a, 6a. PCOPYRIGHT: (C)2009,JPO&INPIT
机译:

要解决的问题:提供一种多层印刷电路板和一种连接结构,其能够减少信号在同轴连接器和多层印刷电路板之间的接口上的反射,并且可以在较低的成本下投入实际使用。通过确保更高水平的界面处的电磁场分布的连续性来降低成本。解决方案:多层印刷电路板1具有微带线2作为信号层,并且在微带线2的下部设置有多个接地层3a,4a,5a,6a,7a以进行电连接。相互。在多个接地层3a,4a,5a,6a,7a中的至少一些接地层3a,4a,5a,6a中设置有切口K3,K4,K5,K6,以及切口K3,K4,K5的尺寸对于每个接地层3a,4a,5a,6a,K1,K6被制成不同。

版权:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP5320704B2

    专利类型

  • 公开/公告日2013-10-23

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP20070217903

  • 发明设计人 若林 良昌;

    申请日2007-08-24

  • 分类号H05K3/46;H01L23/12;H05K1/02;H01R9/05;H01P5/08;

  • 国家 JP

  • 入库时间 2022-08-21 16:58:16

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