MULTILAYER PRINTED CIRCUIT BOARD STRUCTURE AND IC MOUNTING STRUCTURE OF MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To reduce to minimum the wiring length between bare chip ICs. ;SOLUTION: The pads 21-1 to 21-7 of a bare chip IC 21 are connected to pads 23-1 to 23-7 with wires 36-1 to 36-7. The pads 22-1 to 22-7 of a bare chip IC 22 are connected to pads 24-1 to 24-7 with wires 37-1 to 37-7. The pads 23-1 and 24-1 are connected together with a conductor 25-1, a via land 27-1, a bonding material 35-1, a conductor 34-1 and a conductor 26-1. The pads 23-2 and 24-2 are connected together with a conductor 25-2, a bonding material 35-2, a conductor 33-1, a bonding material 35-2, a conductor 26-2, and a via land 28-1. The pads 23-3 and 24-3 and via lands 27-2 and 28-2 are connected together with conductors 25-3 and 26-3. The pads 23-4 and 24-4 and the pads 23-5 and 24-5 are connected together the same as above.;COPYRIGHT: (C)1998,JPO