首页> 外国专利> CHEMICAL AMPLIFICATION TYPE RESIST COMPOSITION, RESIST FILM USING THE SAME, RESIST APPLICATION MASK BLANK, RESIST PATTERN FORMATION METHOD, AND PHOTOMASK

CHEMICAL AMPLIFICATION TYPE RESIST COMPOSITION, RESIST FILM USING THE SAME, RESIST APPLICATION MASK BLANK, RESIST PATTERN FORMATION METHOD, AND PHOTOMASK

机译:化学增幅型抗蚀剂组成,使用相同的抗蚀剂膜,抗蚀剂施加空白,抗蚀剂图案形成方法和光掩模

摘要

PROBLEM TO BE SOLVED: To provide a chemical amplification type resist composition capable of forming a pattern which simultaneously satisfies high sensitivity, high resolution (for example, high resolution, excellent pattern shape, less edge roughness(LER)), and successful dry etching resistance, a resist film, a resist application mask blank using the same, a resist pattern formation method, and a photomask.;SOLUTION: The chemical amplification type resist composition contains: (A) a cyclic compound which is expressed by the following general formula (1); and (B) a compound which produces acid by irradiation of active rays or radiation. However, the cyclic compound (A) and the compound (B) which produces acid by the irradiation of the active rays or the radiation may be the same compound. In the general formula (1), L represents a single bond or divalent connection group. R1 represents a substituent group or a hydrogen atom. R' represents a polycyclic aliphatic group, m represents integers of 1-4, and n represents integers of 3-8.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种化学增幅型抗蚀剂组合物,该抗蚀剂组合物能够形成同时满足高灵敏度,高分辨率(例如,高分辨率,优异的图案形状,较小的边缘粗糙度(LER))以及成功的耐干蚀刻性的图案。 ,抗蚀剂膜,使用该抗蚀剂膜的抗蚀剂施加掩模坯料,抗蚀剂图案形成方法和光掩模。解决方案:化学放大型抗蚀剂组合物包含:(A)由以下通式表示的环状化合物( 1); (B)通过活性射线或放射线的照射而产生酸的化合物。然而,环状化合物(A)和通过活性射线的照射或放射线产生酸的化合物(B)可以是相同的化合物。通式(1)中,L表示单键或二价连接基团。 R 1 表示取代基或氢原子。 R'表示多环脂族基团,m表示1-4的整数,n表示3-8的整数。;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013007785A

    专利类型

  • 公开/公告日2013-01-10

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20110138757

  • 发明设计人 TSUCHIMURA TOMOTAKA;INAZAKI TAKESHI;

    申请日2011-06-22

  • 分类号G03F7/004;G03F7/038;G03F7/039;H01L21/027;

  • 国家 JP

  • 入库时间 2022-08-21 16:57:56

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