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Design method of the production method and the photo resist pattern of the film carrier tape for mounting electronic components

机译:电子零件安装用薄膜载带的制造方法及光刻胶图案的设计方法

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a film-carrier tape for mounting electronic components and a method of designing a photoresist pattern capable of suppressing the generation of difference of inner lead length and generation of a taper shape.;SOLUTION: A method of designing a photoresist pattern designs a photoresist pattern 2a for forming an inner lead 6a. In the method, the photoresist pattern 2a has an inner lead pattern obtained by extending a pattern having the same shape as the inner lead 6a in a width direction, and a correction region pattern formed at a head end of the inner lead pattern. A hole 1 is formed in the correction region pattern, and a predetermined distance S is formed between the hole 1 and the head end of the inner lead pattern.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种制造用于安装电子部件的膜载带的方法以及一种设计能够抑制内部引线长度的差异的产生和锥形形状的产生的光致抗蚀剂图案的方法。设计光致抗蚀剂图案的方法设计用于形成内部引线6a的光致抗蚀剂图案2a。在该方法中,光致抗蚀剂图案2a具有通过在宽度方向上延伸具有与内部引线6a相同形状的图案而获得的内部引线图案,以及形成在内部引线图案的前端的校正区域图案。在校正区域图形中形成孔1,并且在孔1与内部引线图形的头端之间形成预定距离S。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP5223634B2

    专利类型

  • 公开/公告日2013-06-26

    原文格式PDF

  • 申请/专利权人 セイコーエプソン株式会社;

    申请/专利号JP20080308250

  • 发明设计人 菅原 宏之;

    申请日2008-12-03

  • 分类号H01L21/60;

  • 国家 JP

  • 入库时间 2022-08-21 16:57:17

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