首页> 外国专利> The substrate central processing unit, substrate treatment manner, using the computer reading possible record media null treatment liquid which records the substrate treatment program,

The substrate central processing unit, substrate treatment manner, using the computer reading possible record media null treatment liquid which records the substrate treatment program,

机译:基板中央处理单元,以基板处理方式,利用计算机读取可能的记录介质为空的处理液,记录基板处理程序,

摘要

PROBLEM TO BE SOLVED: To highly accurately supply a processing liquid of a predetermined flow rate and a predetermined concentration to a substrate processing section of a substrate processing apparatus.;SOLUTION: The substrate processing apparatus (1) has a structure in which a plurality of substrate processing portions (11-22) process a substrate (2) while using a processing liquid supplied from a processing liquid supply portion (24). The apparatus (1) sequentially carries the substrate (2) to each of the substrate processing portions (11-22), and when the flow rate of the processing liquid used by a single substrate processing portion (11-22) is smaller than the flow rate controllable by the processing liquid supply portion (24), a processing start time is controlled so that the substrates (2) are carried to the plurality of substrate processing portions (11-22) until the flow rate becomes controllable or above by the processing liquid supply portion (24) and then the processing liquid is simultaneously used by the plurality of substrate processing portions (11-22).;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:高精度地将预定流量和预定浓度的处理液供给到基板处理装置的基板处理部。解决方案:基板处理装置(1)具有多个基板处理部(11-22)一边使用从处理液供给部(24)供给的处理液一边对基板(2)进行处理。设备(1)将基板(2)顺序地运送到每个基板处理部(11-22),并且当单个基板处理部(11-22)所使用的处理液的流量小于基板处理部(11-22)的流量时。通过处理液供给部(24)可控制流量,控制处理开始时间,以使基板(2)被运送到多个基板处理部(11-22),直到通过该控制可控制流量以上。处理液供应部分(24),然后由多个基板处理部分(11-22)同时使用处理液。;版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP5160341B2

    专利类型

  • 公开/公告日2013-03-13

    原文格式PDF

  • 申请/专利权人 東京エレクトロン株式会社;

    申请/专利号JP20080211952

  • 发明设计人 北原 重徳;

    申请日2008-08-20

  • 分类号H01L21/304;H01L21/306;

  • 国家 JP

  • 入库时间 2022-08-21 16:56:31

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