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Pb-free soldering copper alloy plate with Sn plating for PCB male terminal which is excellent in resistance

机译:PCB阳性端子用无铅锡合金镀锡铜合金板

摘要

PPROBLEM TO BE SOLVED: To produce a PCB male terminal excellent in Pb-free solderability and having sufficient strength and electric conductivity from a copper alloy plate on both sides of which Sn is plated before blanking. PSOLUTION: The copper alloy plate with Sn plating for PCB male terminals for producing the PCB male terminals has Sn plated layers on both surfaces and has shear-cut end faces by press blanking on both end faces. The copper alloy contains 0.05-2.6 mass% Fe, 0.01-0.2 mass% P, and one or two of 0.01-5 mass% Zn and 0.01-2 mass% Ni, and the balance Cu with inevitable impurities. Alternatively, the copper alloy contains 0.01-2 mass% Ni, 0.01-0.2 mass% P, and the balance Cu with inevitable impurities. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:通过在冲裁前在其两侧镀锡的铜合金板来生产无铅可焊性极佳且具有足够强度和导电性的PCB公端子。

解决方案:用于生产PCB阳端子的PCB阳端子的镀锡铜合金板在两个表面上均具有Sn镀层,并通过在两个端面上进行冲裁来形成剪切端面。铜合金含有0.05〜2.6质量%的Fe,0.01〜0.2质量%的P以及0.01〜5质量%的Zn和0.01〜2质量%的Ni中的1个或2个,余量的Cu具有不可避免的杂质。或者,铜合金包含0.01〜2质量%的Ni,0.01〜0.2质量%的P以及余量的Cu以及不可避免的杂质。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP5311860B2

    专利类型

  • 公开/公告日2013-10-09

    原文格式PDF

  • 申请/专利权人 株式会社神戸製鋼所;

    申请/专利号JP20080087809

  • 发明设计人 三輪 洋介;西村 昌泰;

    申请日2008-03-28

  • 分类号C22C9/00;C22C9/06;C22F1/08;C22C9/04;C22F1/00;B23K1/19;B23K1/00;B23K101/42;B23K103/12;

  • 国家 JP

  • 入库时间 2022-08-21 16:54:43

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