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Properties of Electroplated Sn-Ag Alloy Films as Pb-Free Solderable Coating Obtained by Composite Plating.

机译：电镀Sn-Ag合金膜的性能作为通过复合电镀获得的无铅可焊接涂层。

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Yutaka FUJIWARA; Toshimitsu NAGAO; Hidehiko ENOMOTO; Hiroshi HOSHIKA;
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年度 2002
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1. Preparation of Sn-Ag Alloy Films by Composite Plating of Ag Nanoparticles and Their Application to Pb-Free Solder plating [J] . Yutaka Fujiwara, Hidehiko Enomoto 表面技術 . 2000,第期

机译：银纳米粒子复合电镀制备Sn-Ag合金膜及其在无铅焊料中的应用
2. Composite plating of Sn-Ag alloys for Pb-free soldering [J] . Fujiwara Y., Enomoto H., Nagao T., Surface & Coatings Technology . 2003,第0期

机译：用于无铅焊接的Sn-Ag合金的复合镀层
3. Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate [J] . Erer A.M., Candan E., Güven M.H., The European physical journal. Applied physics . 2011,第1期

机译：无铅锡银焊料在铜基体上的接触角的测量与预测
4. High Temperature Properties of Joints Made with Cu-10Ni/Sn-Alloy Pb-Free Composite Solder Powder Paste [C] . S. M. Choquette, I. E. Anderson International Conference on Powder Metallurgy Particulate Materials . 2017

机译：用Cu-10Ni / Sn-Alloy PB无铅复合焊料粉末浆料制备的接头的高温性能
5. Morphology and Properties of Clay/Nylon-6-Epoxy Nanocomposites, Coatings and Films [D] . Vyas, Aniket. 2014

机译：粘土/尼龙6-环氧纳米复合材料，涂层和薄膜的形态和性能
6. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [O] . Chih-han Yang, Shiqi Zhou, Shih-kang Lin, 2019

机译：Sn-Bi-In-Ga四元合金低温无铅焊料的计算热力学辅助开发
7. Sn-Ag Alloy Electroplating for Use as Pb-Free Solder. [O] . Susumu ARAI, Tohru WATANABE 1998

机译：Sn-Ag合金电镀用作无铅焊料。
8. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits [R] . Hernandez, C. L. , Vianco, P. T. , Rejent, J. A. , 1998

机译：厚膜混合微电路上无铅焊料合金的力学性能

Properties of Electroplated Sn-Ag Alloy Films as Pb-Free Solderable Coating Obtained by Composite Plating.

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