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Being the lateral electric conduction die Schottky diode null Schottky diode semiconductor

机译:作为横向导电芯片,肖特基二极管无效肖特基二极管半导体

摘要

A lateral conduction Schottky diode (300) includes multiple mesa regions upon which Schottky contacts (310) are formed and which are at least separated by ohmic contacts (316) to reduce the current path length and reduce current crowding in the Schottky contact, thereby reducing the forward resistance of a device. The multiple mesas may be isolated from one another and have sizes and shapes optimized for reducing the forward resistance. Alternatively, some of the mesas may be finger-shaped and intersect with a central mesa or a bridge mesa, and some or all of the ohmic contacts are interdigitated with the finger-shaped mesas. The dimensions of the finger-shaped mesas and the perimeter of the intersecting structure may be optimized to reduce the forward resistance. The Schottky diodes may be mounted to a submount in a flip chip arrangement that further reduces the forward voltage as well as improves power dissipation and reduces heat generation. IMAGE
机译:横向导电肖特基二极管(300)包括在其上形成肖特基接触(310)并且至少被欧姆接触(316)隔开的多个台面区域,以减小电流路径长度并减少肖特基接触中的电流拥挤,从而减小设备的正向电阻。多个台面可以彼此隔离,并且具有针对减小前向电阻而优化的尺寸和形状。替代地,一些台面可以是手指形的并且与中央台面或桥式台面相交,并且一些或全部欧姆接触与手指形台面相互交叉。手指形台面的尺寸和相交结构的周边可以被优化以减小前向阻力。肖特基二极管可以倒装芯片的方式安装到基座上,这进一步降低了正向电压,并改善了功耗并减少了热量的产生。 <图像>

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