Production method of Bi-containing solder foil, Bi-containing solder foil, assembly, and power semiconductor module

摘要

PPROBLEM TO BE SOLVED: To provide a method of manufacturing Bi-containing solder foil and Bi-containing solder foil, and to provide a joined body that is highly heat resistant and accurately welded and a power semiconductor module. PSOLUTION: In the method of manufacturing Bi-containing solder foil, powder of a solder material containing bismuth (Bi) is formed into a sheet by a powder rolling method. The ratio of a long side and a short side in the powder of the solder material is suitably ≥1.2 and ≤3.0 while the mean particle diameter of the powder is suitably ≥5 μm and ≤200 μm. The rolling by the powder rolling method is desirably performed at ≥-20°C and ≤269°C. Also, in the joined body and the power semiconductor module, the Bi-containing solder foil is used in the weld zone. PCOPYRIGHT: (C)2010,JPO&INPIT