首页> 外文OA文献 >Influence of Antimony on Reliability of Solder Joints Using Sn-Sb Binary Alloy for Power Semiconductor Modules

【2h】

Influence of Antimony on Reliability of Solder Joints Using Sn-Sb Binary Alloy for Power Semiconductor Modules

机译：锑对功率半导体模块Sn-Sb二元合金对焊点可靠性的影响

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Akira Morozumi; Hiroaki Hokazono; Yoshitaka Nishimura; Eiji Mochizuki; Yoshikazu Takahashi;
展开▼
作者单位

展开▼
年度 2015
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Influence of Cooling Rates on Reliability of Solder Joints Using Sn–13wt.% Sb Binary Alloy for Power Semiconductor Modules [J] . Akira Morozumi, Hiroaki Hokazono, Yoshitaka Nishimura, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2016,第8期

机译：冷却速率对使用Sn-13wt。％Sb二元合金的功率半导体模块焊点可靠性的影响
2. Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size [J] . M. Thoben, X. Xie, D. Silber Microelectronics & Reliability . 2001,第9a10期

机译：AlSiC基板功率模块中芯片/ DCB焊点的可靠性：芯片尺寸的影响
3. Nanoparticle/solder hybrid joints for next-generation power semiconductor modules [J] . Satoh Toshikazu, Ishizaki Toshitaka, Usui Masanori Materials & design . 2017,第JUNa期

机译：用于下一代功率半导体模块的纳米粒子/焊料混合接头
4. INFLUENCE OF SURFACE FINISHES AND SOLDER ALLOYS ON SOLDER BALL JOINT RELIABILITY [C] . Yoshinori Ejiri, Takaaki Noudou, Takehisa Sakurai, SMTA International Conference . 2015

机译：表面饰面和焊料合金对焊球关节可靠性的影响
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications [O] . John D. Sørensen, Erik E. Kostandyan 2011

机译：风力机应用中裂纹损伤模型的电力电子模块焊点可靠性评估

Influence of Antimony on Reliability of Solder Joints Using Sn-Sb Binary Alloy for Power Semiconductor Modules

著录项

引文网络

相似文献

相关主题

期刊订阅