METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYER

摘要

Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer.