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ALIGNMENT MARKS FOR MULTI-EXPOSURE LITHOGRAPHY

机译:多重曝光光刻的对准标记

摘要

A plurality of reticles for printing structures in the same lithography level includes an alignment structure pattern within a same relative location in each reticle. Each set of process segmentations in a grating has a reticle segmentation pitch, which is common across all gratings in the plurality of reticles. Within each pair of alignment structure patterns that occupy the same relative location in any two of the plurality of reticles, the process segmentations in one reticle are shifted relative to the process segmentations in the other reticle by a fraction of a reticle segmentation pitch. After printing all patterns in the plurality of reticles, a composite printed process segmentation structure on the substrate includes printed segmentation structures that are spaced by 1/n times the printed segmentation pitch. The pattern for the next level can be aligned to the composite printed process segmentation structure in a single alignment operation.
机译:用于在相同光刻水平上印刷结构的多个掩模版包括在每个掩模版中相同相对位置内的对准结构图案。光栅中的每组过程分割都具有标线片分割间距,该间距在多个掩模版中的所有光栅上都相同。在多个掩模版中的任意两个掩模版中占据相同相对位置的每一对对准结构图案内,一个掩模版中的过程分割相对于另一个掩模版中的过程分割移动了掩模版分割间距的一部分。在将多个掩模版中的所有图案印刷之后,在基板上的复合印刷工艺分割结构包括印刷分割结构,其以印刷分割节距的1 / n倍隔开。可以在单个对齐操作中将下一级的图案对齐到复合印刷工艺分段结构。

著录项

  • 公开/公告号US2013001193A1

    专利类型

  • 公开/公告日2013-01-03

    原文格式PDF

  • 申请/专利权人 ALLEN H. GABOR;VINAYAN C. MENON;

    申请/专利号US201113170316

  • 发明设计人 VINAYAN C. MENON;ALLEN H. GABOR;

    申请日2011-06-28

  • 分类号B44C1/22;G03F1/00;

  • 国家 US

  • 入库时间 2022-08-21 16:49:19

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