首页>
外国专利>
Multilayer printed board and method for manufacturing the same
Multilayer printed board and method for manufacturing the same
展开▼
机译:多层印制板及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Provided is a multilayer printed board 10 having three single-sided conductor pattern films 16 each having a conductor pattern 13 formed on one surface of a resin film 12 having a through hole 11 and a filled through hole 15 that is the through hole 11 filled with a conductor 14 integrally with the conductor pattern 13. These single-sided conductor pattern films 16 are stacked in such a manner that their tops are oriented in the same way. The conductor patterns 13 of the single-sided conductor pattern films 16 are electrically connected via the filled through holes 15. As the conductor patterns 13 of the single-sided conductor pattern films 16 are interlayer connected via the filled through holes 15, the interlayer connection reliability can be enhanced.
展开▼