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Lattice matched semiconductor growth on crystalline metallic substrates

机译:晶格匹配晶体在金属晶体衬底上的生长

摘要

Methods of fabricating a semiconductor layer or device and said devices are disclosed. The methods include but are not limited to providing a metal or metal alloy substrate having a crystalline surface with a known lattice parameter (a). The methods further include growing a crystalline semiconductor alloy layer on the crystalline substrate surface by coincident site lattice matched epitaxy. The semiconductor layer may be grown without any buffer layer between the alloy and the crystalline surface of the substrate. The semiconductor alloy may be prepared to have a lattice parameter (a′) that is related to the lattice parameter (a). The semiconductor alloy may further be prepared to have a selected band gap.
机译:公开了制造半导体层或器件的方法以及所述器件。该方法包括但不限于提供具有已知晶格参数(a)的晶体表面的金属或金属合金基底。该方法进一步包括通过重合的位点晶格匹配的外延在晶体衬底表面上生长晶体半导体合金层。可以在合金和衬底的晶体表面之间没有任何缓冲层的情况下生长半导体层。可以将半导体合金制备成具有与晶格参数(a)有关的晶格参数(a')。可以进一步制备半导体合金以具有选定的带隙。

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