Integrated method for high-density interconnection of electronic components through stretchable interconnects

摘要

Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer electronics such as elastic displays, skin-like electronic sensors, etc. In particular, stretchable neural implants provide improved performances as to cause less mechanical stress and thus fewer traumas to surrounding soft tissues. Such SMCMs usually comprise of various electronic components attached to or embedded in a polydimethylsiloxane (PDMS) substrate and wired through stretchable interconnects. However, reliably and compactly connecting the electronic components to PDMS-based stretchable interconnects is very challenging. This invention describes an integrated method for high-density interconnection of electronic components through stretchable interconnects in an SMCM. This invention has applications in high-density SMCMs, as well as high-density stretchable/conformable neural interfaces.